Evaluation of preheating impact on weld residual stresses in AH-36 steel using Finite Element Analysis

Atif Shazad; Muhammad Astif; Muhammad Uzair; Asad A. Zaidi

doi:10.36561/ING.26.14

Autores

Atif Shazad NED University of Engineering and Technology, Pakistán https://orcid.org/0000-0002-3277-7901
Muhammad Astif National University of Sciences and Technology, Pakistán https://orcid.org/0000-0003-4318-8253
Muhammad Uzair NED University of Engineering and Technology, Pakistán https://orcid.org/0000-0002-2033-6244
Asad A. Zaidi Islamic University of Madinah, Arabia Saudita

DOI:

https://doi.org/10.36561/ING.26.14

Palavras-chave:

Mitigação, AH-36, Abaqus, Tensões residuais, Análise de elementos finitos

Resumo

A indústria da construção naval é uma indústria valiosa e lucrativa que desempenha um papel vital no desenvolvimento económico do país. Os navios têm um impacto crucial no comércio do país devido ao apoio necessário ao transporte marítimo. Além disso, os navios podem ser utilizados para proteger a área costeira. Aço utilizado principalmente na construção de navios devido à sua boa resistência e durabilidade. Este estudo enfatiza a análise de tensões residuais do aço para construção naval AH-36. O software Abaqus é utilizado para análise de elementos finitos para avaliar tensões residuais. A mitigação destas tensões residuais é muito essencial; portanto, a técnica de pré-aquecimento é discutida neste estudo. O pré-aquecimento foi realizado em três temperaturas, ou seja, 100ºC, 150ºC e 200ºC. Os resultados indicam que as tensões de Von Mises diminuíram efetivamente devido ao pré-aquecimento. Foram observadas reduções de 12,6%, 21% e 45,6% nas temperaturas de pré-aquecimento 100ºC, 150ºC e 200ºC respectivamente. Uma avaliação mais aprofundada das tensões revelou que, devido ao pré-aquecimento da placa de base, as tensões longitudinais foram reduzidas para 21,3%, 44% e 52,4% aumentando a temperatura de pré-aquecimento de 100ºC, 150ºC e 200ºC, respectivamente. A mitigação do gradiente térmico entre a zona de solda e a placa de base resultou na redução das tensões globais da placa de base.

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